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ASE ChungLi (ASECL), a member of the ASE Group, delivers comprehensive semiconductor manufacturing services, including engineering test, package design, IC assembly, wafer probing, final test, and design manufacturing services (DMS).
With advanced technologies and vast capacity, ASECL provides industry-leading backend manufacturing services at its Intelligible Park facility in ChungLi. Our turnkey services encompass a wide variety of backend processes, including IC test program design, front-end engineering test, substrate and package design, substrate manufacturing, as well as package tooling during the wafer fabrication process. These services are complemented by ASECL’s seamless logistics management, evident throughout all stages, and ultimately responsible for driving down cycle times and increasing efficiency.
ASECL possesses expertise in product and process technology, essential for the development of leading-edge packages including Chip Scale Packages (CSP), Multi Chip Modules (MCM), thermally enhanced packages, flip chip packages, and memory.
Located in the heart of Taiwan’s semiconductor cluster, ASECL leverages its prime location to serve both fabless companies and integrated device manufacturers (IDMs), who cater to the expanding consumer, computer, and communications markets.